Using of solderable conductive pastes in PCB prototyping

Author

Marin, Alexandru ; Svasta, Paul ; Ionescu, Ciprian ; Codreanu, Norocel-Dragos

Author_Institution

Center of Technol. Electron. & Interconnection Techniques, "POLITEHNICA" Univ. of Bucharest, Romania

fYear

2002

fDate

2002

Firstpage

17

Lastpage

21

Abstract

The paper presents some tests in the field of through-hole plating process using special solderable conductive pastes in order to metallize the barrel of drilled holes for vias. The process consists of dispensing the special paste into holes, absorption of paste from them, keeping inside only the necessary quantity for metallization, and curing the paste into a regular hot-air oven at 160°C for 30 minutes. The process is appropriate for small/medium quantity of vias (less than 400) and FR4 substrate. The contact resistance, specified by producer as 150 mΩ, will be analyzed. In addition, pastes shall be evaluated as soldering materials destined for contacting the SMDs onto the printed circuit boards.

Keywords

Poiseuille flow; adhesives; contact resistance; filled polymers; metallisation; non-Newtonian flow; printed circuit manufacture; shear flow; surface mount technology; 150 mohm; 160 C; 30 min; FR4 substrate; PCB prototyping; Poiseuille viscometric motion; SMD; contact resistance; curing; drilled hole barrel; metallization; nonNewtonian character; numerical simulations; paste absorption; shear flow; solderable conductive pastes; through-hole plating process; time-pressure procedure; velocity distribution; vias; Absorption; Curing; Electronic equipment testing; Equations; Integrated circuit interconnections; Marine technology; Metallization; Ovens; Paper technology; Prototypes;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on

Print_ISBN

0-7803-7567-X

Type

conf

DOI

10.1109/POLYTR.2002.1020177

Filename

1020177