• DocumentCode
    1989763
  • Title

    Advanced modeling of charge trapping at oxide defects

  • Author

    Schanovsky, Franz ; Goes, W. ; Grasser, Tibor

  • Author_Institution
    Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    451
  • Lastpage
    458
  • Abstract
    Several reliability issues in MOS transistors - such as the bias temperature instability, hot-carrier degradation, and gate leakage - have been indicated to involve the capture and emission of carriers at point-defects in the oxide. The trapping behavior of these defects depends on the device temperature and the oxide field in a highly non-trivial manner. Detailed capture and emission time constants of single defects have recently been obtained from time-dependent defect spectroscopy (TDDS) measurements. The complex behavior of these time constants is most accurately explained using a multi-state multi-phonon model. In this model, the defects capture and emit carriers through a non-radiative multi-phonon process. Additionally, each defect has (at least) two internal states where each of them gives rise to different trapping dynamics. We give a brief and hopefully intuitive introduction to the theory of non-radiative multi-phonon capture and emission and to the concept of multi-state defects. The relation to the commonly used Shockley-Read-Hall defect description in semiconductor device modeling is discussed.
  • Keywords
    MOSFET; electron traps; hot carriers; negative bias temperature instability; point defects; semiconductor device models; semiconductor device reliability; MOS transistors; Shockley-Read-Hall defect description; TDDS; bias temperature instability; charge trapping; gate leakage; hot carrier degradation; multistate multiphonon model; nonradiative multiphonon process; oxide defects; point defects; reliability; semiconductor device modeling; time-dependent defect spectroscopy; trapping dynamics; Electron traps; Quantum mechanics; Semiconductor device modeling; Shape; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650671
  • Filename
    6650671