DocumentCode
1989933
Title
The analysis and evaluation of chip scale package (CSP) solder joint reliability
Author
Yang, HongZhen ; Cao, XinYu
Author_Institution
Electron. Eng. Dept., North China Inst. of Aerosp. Eng., Langfang, China
fYear
2011
fDate
16-18 Sept. 2011
Firstpage
1315
Lastpage
1318
Abstract
Analysis using ANSYS software, CSP component was reduced to two-dimensional model. In the thermal cyclic loading conditions using finite element simulating the stress and strain distribution of CSP components, obtained a dangerous solder joint of structural failure. The number of failure cycles about dangerous solder joint was predicted. Finally, introduced several analysis and evaluation method for the CSP solder joint reliability evaluation.
Keywords
chip scale packaging; finite element analysis; production engineering computing; reliability; soldering; stress-strain relations; ANSYS software; CSP solder joint reliability; chip scale package; finite element simulation; stress-strain distribution; structural failure; thermal cyclic loading condition; Chip scale packaging; Finite element methods; Reliability; Soldering; Strain; Stress; Temperature distribution; CSP; Chip Scale Package; Finite element analysis; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Control Engineering (ICECE), 2011 International Conference on
Conference_Location
Yichang
Print_ISBN
978-1-4244-8162-0
Type
conf
DOI
10.1109/ICECENG.2011.6057842
Filename
6057842
Link To Document