DocumentCode :
1989937
Title :
Low-transmission-loss modified cyanate ester materials for high-frequency applications
Author :
Fujimoto, Daisuke ; Mizuno, Yasuyuki ; Takano, Nozomu ; Sase, Shigeo ; Negishi, Harumi ; Sugimura, Takeshi
Author_Institution :
Res. & Dev. Center, Hitachi Chem. Co. Ltd., Ibaraki, Japan
fYear :
2002
fDate :
2002
Firstpage :
114
Lastpage :
119
Abstract :
Cyanate esters cure through cyclotrimerization of reactive cyanate functional groups into resins with three-dimensional and densely cross-linked structures. i.e. triazine resins, which have low dielectric constants and high glass transition temperatures. Aryl cyanate esters had been of great interest as materials for low-dielectric-constant circuit boards; however, their dielectric properties could not satisfy the demands for high-speed communication. We have found that novel modified cyanate ester resins will show much lower dielectric constant/loss and better compatibility with high molecular weight thermoplastic polymers. Judging from the structure/property relationships obtained through the analytical results of their chemical structures and the studies on their visco-elastic properties, we have concluded that the above characteristics were due to the unique resin structures. We developed semi-intermolecular-penetrating network (semi-IPN) materials by combining modified cyanate ester resins with thermoplastic polymers which provide low dissipation factor in GHz frequency range. Circuit boards with glass cloths and these materials demonstrated low transmission losses in the frequency range up to 30 GHz. These excellent microwave properties will ensure an advantage to the novel modified cyanate ester resins as materials for circuit boards in high-speed communications technology.
Keywords :
dielectric losses; glass transition; microwave materials; molecular weight; permittivity; polymer blends; polymer structure; polymerisation; printed circuit manufacture; viscoelasticity; chemical structures; circuit boards; compatibility; cyanate esters; cyclotrimerization; densely cross-linked structures; elusion curve; glass transition temperatures; high molecular weight thermoplastic polymers; high-frequency applications; low dielectric constants; low dissipation factor; low-transmission-loss modified materials; microwave properties; modified resins; reactive cyanate functional groups; semi-intermolecular-penetrating network materials; structure-property relationships; triazine resins; viscoelastic properties; wiring boards; Chemical analysis; Dielectric constant; Dielectric materials; Frequency; Glass; High-K gate dielectrics; Polymers; Printed circuits; Resins; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on
Print_ISBN :
0-7803-7567-X
Type :
conf
DOI :
10.1109/POLYTR.2002.1020193
Filename :
1020193
Link To Document :
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