• DocumentCode
    1990354
  • Title

    Packaging of LED backlights for ruggedised displays

  • Author

    Bailey, C. ; Lee, Y. ; Lu, H. ; Strusevich, N. ; Yin, C.

  • Author_Institution
    Comput. Mech. & Reliability Group, Univ. of Greenwich, London, UK
  • fYear
    2010
  • fDate
    Feb. 28 2010-March 2 2010
  • Firstpage
    98
  • Lastpage
    101
  • Abstract
    Light emitting diodes (LEDs) can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effect on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes optical and thermal modelling techniques used to predict key design parameters such as luminance and temperature for ruggedized electronic display´s using an array of LEDs as the backlight.
  • Keywords
    LED displays; brightness; electronic equipment manufacture; heat sinks; thermal analysis; LED backlights packaging; light emitting diodes; luminance; optical modelling techniques; ruggedised displays; thermal modelling techniques; Adaptive control; Displays; Light emitting diodes; Lighting control; Optical arrays; Optical design; Packaging; Programmable control; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Microtech, 2010. APM '10. International Symposium on
  • Conference_Location
    Cambridge
  • Print_ISBN
    978-1-4244-6756-3
  • Type

    conf

  • DOI
    10.1109/ISAPM.2010.5441377
  • Filename
    5441377