DocumentCode :
1990354
Title :
Packaging of LED backlights for ruggedised displays
Author :
Bailey, C. ; Lee, Y. ; Lu, H. ; Strusevich, N. ; Yin, C.
Author_Institution :
Comput. Mech. & Reliability Group, Univ. of Greenwich, London, UK
fYear :
2010
fDate :
Feb. 28 2010-March 2 2010
Firstpage :
98
Lastpage :
101
Abstract :
Light emitting diodes (LEDs) can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effect on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes optical and thermal modelling techniques used to predict key design parameters such as luminance and temperature for ruggedized electronic display´s using an array of LEDs as the backlight.
Keywords :
LED displays; brightness; electronic equipment manufacture; heat sinks; thermal analysis; LED backlights packaging; light emitting diodes; luminance; optical modelling techniques; ruggedised displays; thermal modelling techniques; Adaptive control; Displays; Light emitting diodes; Lighting control; Optical arrays; Optical design; Packaging; Programmable control; Thermal management; Thermal management of electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Microtech, 2010. APM '10. International Symposium on
Conference_Location :
Cambridge
Print_ISBN :
978-1-4244-6756-3
Type :
conf
DOI :
10.1109/ISAPM.2010.5441377
Filename :
5441377
Link To Document :
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