Title :
Piezoelectric composite film for acoustic emission detection
Author :
Sakamoto, Walter Katsumi ; Higuti, Ricardo Tokio ; Tiago, Marcelo Moreira
Author_Institution :
Dept. of Phys. & Chem., UNESP - Sao Paulo State Univ., Ilha Solteira, Brazil
Abstract :
The continuous technological advances require materials with properties that conventional material cannot display. Material property combinations are being the focus to the development of composite materials, which are considered a multiphase material that exhibits properties of the constituent phases. One interesting material to be studied as sensing material is the composite made of ferroelectric ceramic and polymeric matrix as a two-phases composite material. In that case, the combinations properties intended are the high piezo and pyroelectric activities of the dense ceramic with the impact resistance, flexibility, formability and low densities of the polymer. Using the piezoelectric property of the composite film, it can be used to detect acoustic emission (AE), which is a transient elastic wave generated by sudden deformation in materials under stress. AE can be applied for evaluating the ¿health¿ of structures in a nondestructive way and without any lapse of time. The preliminary result indicates that the composite Pz34/PEEK can be used as sensing material for nondestructive evaluation.
Keywords :
acoustic emission; composite materials; ferroelectric ceramics; nondestructive testing; piezoelectric materials; polymers; pyroelectricity; acoustic emission detection; composite Pz34/PEEK; density; ferroelectric ceramic; flexibility; formability; impact resistance; material property combinations; multiphase material; nondestructive evaluation; piezoelectric activities; piezoelectric composite film; polymeric matrix; pyroelectric activities; sensing material; transient elastic wave; Acoustic emission; Acoustic signal detection; Ceramics; Composite materials; Displays; Ferroelectric materials; Material properties; Piezoelectric films; Polymers; Pyroelectricity;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441422