DocumentCode
1991721
Title
The calculation of electrical parameters of film bulk acoustic wave resonators from vibrations of layered piezoelectric structures
Author
Wang, Ji ; Liu, Jiansong ; Du, Jianke ; Huang, Dejin
Author_Institution
Piezoelectr. Device Lab., Ningbo Univ., Ningbo, China
fYear
2009
fDate
20-23 Sept. 2009
Firstpage
2027
Lastpage
2030
Abstract
Film bulk acoustic wave resonators (FBARs) are new generation of piezoelectric resonators with higher frequencies and manufacturing process compatible with existing semiconductor technology. With the successful development of FBAR products for wireless communication applications, the FBAR technology are being extensively studied for new technology, products, and applications. Due to the sophistication of the FBAR technology and demands for precision products, it is natural to make use of the full analysis of acoustic waves propagating in the FBAR structures for design and calculating electrical parameters before the fabrication. The analytical approach based on wave propagation in layered structures will be important in improving design and conceiving new products. The introduction of material viscosity will enable the formulation and calculation of FBAR properties with solutions of wave propagation. Current formulation based on one-dimensional approach can be easily extended to the finite structure of smaller FBARs for improved analysis and design. The formulation can also be extended to work with numerical methods which are widely adopted in the FBAR development.
Keywords
acoustic wave propagation; bulk acoustic wave devices; crystal resonators; electric properties; vibrations; viscosity; FBAR technology; acoustic wave analysis; electrical parameter calculation; film bulk acoustic wave resonators; layered piezoelectric structures; material viscosity; piezoelectric resonators; vibrations; wave propagation; wireless communication applications; Acoustic propagation; Acoustic waves; Fabrication; Film bulk acoustic resonators; Manufacturing processes; Piezoelectric films; Resonant frequency; Semiconductor films; Viscosity; Wireless communication; FBAR; electrical parameters; frequency; vibration;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location
Rome
ISSN
1948-5719
Print_ISBN
978-1-4244-4389-5
Electronic_ISBN
1948-5719
Type
conf
DOI
10.1109/ULTSYM.2009.5441439
Filename
5441439
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