• DocumentCode
    1991721
  • Title

    The calculation of electrical parameters of film bulk acoustic wave resonators from vibrations of layered piezoelectric structures

  • Author

    Wang, Ji ; Liu, Jiansong ; Du, Jianke ; Huang, Dejin

  • Author_Institution
    Piezoelectr. Device Lab., Ningbo Univ., Ningbo, China
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    2027
  • Lastpage
    2030
  • Abstract
    Film bulk acoustic wave resonators (FBARs) are new generation of piezoelectric resonators with higher frequencies and manufacturing process compatible with existing semiconductor technology. With the successful development of FBAR products for wireless communication applications, the FBAR technology are being extensively studied for new technology, products, and applications. Due to the sophistication of the FBAR technology and demands for precision products, it is natural to make use of the full analysis of acoustic waves propagating in the FBAR structures for design and calculating electrical parameters before the fabrication. The analytical approach based on wave propagation in layered structures will be important in improving design and conceiving new products. The introduction of material viscosity will enable the formulation and calculation of FBAR properties with solutions of wave propagation. Current formulation based on one-dimensional approach can be easily extended to the finite structure of smaller FBARs for improved analysis and design. The formulation can also be extended to work with numerical methods which are widely adopted in the FBAR development.
  • Keywords
    acoustic wave propagation; bulk acoustic wave devices; crystal resonators; electric properties; vibrations; viscosity; FBAR technology; acoustic wave analysis; electrical parameter calculation; film bulk acoustic wave resonators; layered piezoelectric structures; material viscosity; piezoelectric resonators; vibrations; wave propagation; wireless communication applications; Acoustic propagation; Acoustic waves; Fabrication; Film bulk acoustic resonators; Manufacturing processes; Piezoelectric films; Resonant frequency; Semiconductor films; Viscosity; Wireless communication; FBAR; electrical parameters; frequency; vibration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441439
  • Filename
    5441439