• DocumentCode
    1991998
  • Title

    Modeling and simulation of power distribution plane impedance

  • Author

    Sun, Hongtao ; Xie, Shuguo ; Wang, Kai

  • Author_Institution
    Sch. of Electron. & Inf. Eng., Beijing Univ. of Aeronaut. & Astronaut. (BUAA), Beijing, China
  • fYear
    2011
  • fDate
    16-18 Sept. 2011
  • Firstpage
    5992
  • Lastpage
    5995
  • Abstract
    Basing on the distributed circuit theory, a simple and convenient method for power distribution planes (PDP) impedance calculation has been proposed, which can be utilized for power impedance analysis and capacitor decoupling design of PCB. Firstly, the power distribution plane is meshed non uniformly and then the circuit netlist is automatically generated using MATLAB script. Secondly, the SPICE models of meshed cells, decoupling capacitors and connection vias are built separately and finally, the power port impedance located on the PDP is obtained by AC circuit simulation under the universal SPICE simulation environment. At the end of the paper, an example is given to demonstrate the proposed method. The simulation results are compared with those of commercial software and they agree well with each other.
  • Keywords
    SPICE; electronic engineering computing; integrated circuit modelling; mathematics computing; printed circuit design; AC circuit simulation; MATLAB script; PCB capacitor decoupling design; PDP impedance calculation; SPICE models; circuit netlist; distributed circuit theory; meshed cells; power distribution plane impedance modeling; power distribution plane impedance simulation; power impedance analysis; power port impedance; universal SPICE simulation environment; Analytical models; Capacitors; Educational institutions; Electromagnetic compatibility; Impedance; Integrated circuit modeling; Power distribution; capacitor decoupling; circuit simulation; power distribution planes; power impedance; power integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Control Engineering (ICECE), 2011 International Conference on
  • Conference_Location
    Yichang
  • Print_ISBN
    978-1-4244-8162-0
  • Type

    conf

  • DOI
    10.1109/ICECENG.2011.6057930
  • Filename
    6057930