Title :
Rayleigh-mode spurious analysis for non-flat SiO2/Al/LiNbO3 structure by using FEM/SDA
Author :
Nakamura, H. ; Goto, R. ; Seo, K. ; Nakanishi, H. ; Hashimoto, K. ; Yamaguchi, M.
Author_Institution :
Panasonic Electron. Devices Co., Ltd., Osaka, Japan
Abstract :
The UMTS Band I and Band IV systems have a wide frequency interval between transmitting (Tx) and receiving (Rx) bands. When developing a small-sized SAW duplexer for this application, one needs a substrate with a large electromechanical coupling factor (K2) and a good temperature coefficient of frequency (TCF). Although a SiO2/Al/LiNbO3 structure meets these two requirements, it also supports a certain number of unwanted spurious responses. As previously discussed by the authors, the Rayleigh-mode spurious can be suppressed by controlling the cross-sectional shape of a SiO2 overlay deposited on resonator electrodes. Here, we analyzed the Rayleigh-mode spurious behavior of a non-flat SiO2/Al/LiNbO3 structure by using FEM/SDA. In this study, we applied the extended FEM/SDA to the non-flat SiO2/Al/LiNbO3 structure. The SiO2 structure has a trapezoidal shape, which we developed for suppressing the spurious responses. The analysis indicates that the spurious level due to the Rayleigh-mode decreased with a decrease in the average width of the trapezoidal region. Furthermore, the results of simulation agree well with those obtained experimentally. We have analyzed the behavior of Rayleigh-mode spurious on the non-flat SiO2/Al/LiNbO3 structure. It was shown that the spurious level changes in both the shape and mass of SiO2 on resonator electrodes.
Keywords :
Rayleigh scattering; acoustic wave scattering; aluminium; finite element analysis; lithium compounds; mobile communication; multiplexing equipment; silicon compounds; surface acoustic wave transducers; FEM-SDA; Rayleigh mode spurious analysis; SiO2-Al-LiNbO3; SiO2-Al-LiNbO3 structure; UMTS Band I system; UMTS Band IV system; nonflat silica-aluminium-lithium niobate structure; receiving bands; silica overlay trapezoidal cross section; small sized SAW duplexer; substrate electromechanical coupling factor; substrate temperature frequency coefficient; transmitting bands; 3G mobile communication; Admittance; Electrodes; Frequency; Mobile handsets; Shape control; Substrates; Surface acoustic wave devices; Surface acoustic waves; Temperature; Duplexer; FEM/SDA; LiNbO3; Rayleigh-mode Spurious; SAW; SiO2;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441478