• DocumentCode
    1992624
  • Title

    A 7.9/5.5 psec room/low temperature SOI CMOS

  • Author

    Assaderaghi, F. ; Rausch, W. ; Ajmera, A. ; Leobandung, E. ; Schepis, D. ; Wagner, L. ; Wann, H.-J. ; Bolam, R. ; Yee, D. ; Davari, B. ; Shahidi, G.

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1997
  • fDate
    10-10 Dec. 1997
  • Firstpage
    415
  • Lastpage
    418
  • Abstract
    In this paper we demonstrate the fastest CMOS circuits reported to date. At room temperature the unloaded CMOS inverter delay as low as 7.85 psec is measured. This number drops to 5.5 psec at liquid nitrogen temperature. The devices used in the study are built on SOI, with excellent short-channel characteristics down to 0.06 /spl mu/m for the NFETs and 0.08 /spl mu/m for the PFETs. Although devices with high threshold voltages are used, record delays are achieved at relatively low supply voltages. At 1.8 V, the inverter delay is 8.3 psec and 5.9 psec at T=300 K and T=80 K, respectively. The corresponding delays at 1.2 V are 11.4 psec and 8.2 psec. Through proper device optimization, we demonstrate that undesired SOI floating-body effects are minimized as well. These results demonstrate that there is significant room for continued performance enhancement in scaled CMOS.
  • Keywords
    CMOS logic circuits; delays; elemental semiconductors; isolation technology; logic gates; silicon; silicon-on-insulator; 0.06 micron; 0.08 micron; 1.2 V; 1.8 V; 11.4 ps; 300 K; 5.5 ps; 5.9 ps; 7.9 ps; 8.2 ps; 8.3 ps; 80 K; NFETs; PFETs; Si; floating-body effects; inverter delay; low temperature SOI CMOS; scaled CMOS; short-channel characteristics; threshold voltages; unloaded CMOS inverter; CMOS technology; Current measurement; Delay; Inverters; MOS devices; Pulse measurements; Research and development; Silicides; Temperature; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4100-7
  • Type

    conf

  • DOI
    10.1109/IEDM.1997.650413
  • Filename
    650413