New manufacturing technology of microwave elements and units for communication and navigation systems

A new microwave integration technology of electroplating is proposed, which combines formation and mounting of multilayer structures. It uses a minimal amount of flanges in the waveguide communication lines for extrahigh frequency (EHF), and is capable also to integrate the metallic and non-metallic parts into the waveguide structure with no detachable elements. Products´ weight and dimensions were significantly reduced while ensuring their sufficient rigidity and strength. The mechanical machining, gold and silver coatings were totally excluded; components´ and units´ parameters were improved. The settings and adjustment of the finished product were greatly simplified.