• DocumentCode
    1993158
  • Title

    IC-compatible power oscillators using Thin Film Plate Acoustic Resonators (FPAR)

  • Author

    Avramov, I. ; Arapan, L. ; Katardjiev, I. ; Strashilov, V. ; Yantchev, V.

  • Author_Institution
    Georgy Nadjakov Inst. of Solid State Phys., Sofia, Bulgaria
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    855
  • Lastpage
    858
  • Abstract
    In this study, two-port 880 MHz FPAR devices operating on the lowest order fast symmetric Lamb wave mode (S0) in c-oriented AlN membranes on Si, were fabricated and subsequently tested for their power handling capabilities in a feedback-loop power oscillator circuit. The S0 Lamb waves were excited and detected by a classical two-port resonator structure, as in Rayleigh SAW (RSAW) resonators. Incident power levels of up to 24 dBm (250 mW) for the FPARs were provided by a high-power sustaining amplifier in the loop. No measurable performance degradation was observed. The results from this study indicate that IC-compatible S0 FPAR devices can dissipate orders of magnitude higher RF-power levels than their RSAW counterparts on quartz and are well suited for integrated microwave power oscillators with thermal noise floor (TNF) levels below -175 dBc/Hz.
  • Keywords
    aluminium compounds; feedback oscillators; integrated circuits; microwave oscillators; piezoelectric materials; silicon; surface acoustic wave resonators; surface acoustic waves; thin film devices; AlN; FPAR devices; IC compatible power oscillators; RSAW resonators; Rayleigh SAW resonators; S0 Lamb wave excitation; Si; c oriented aluminium nitride membranes; classical two port resonator structure; feedback loop power oscillator circuit; frequency 880 MHz; integrated microwave power oscillators; low order fast symmetric Lamb wave mode; power handling capability; silicon substrate; thermal noise floor; thin film plate acoustic resonators; Acoustic devices; Acoustic testing; Biomembranes; Circuit testing; Feedback circuits; High power amplifiers; Oscillators; Surface acoustic waves; Thin film circuits; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441502
  • Filename
    5441502