DocumentCode :
1993158
Title :
IC-compatible power oscillators using Thin Film Plate Acoustic Resonators (FPAR)
Author :
Avramov, I. ; Arapan, L. ; Katardjiev, I. ; Strashilov, V. ; Yantchev, V.
Author_Institution :
Georgy Nadjakov Inst. of Solid State Phys., Sofia, Bulgaria
fYear :
2009
fDate :
20-23 Sept. 2009
Firstpage :
855
Lastpage :
858
Abstract :
In this study, two-port 880 MHz FPAR devices operating on the lowest order fast symmetric Lamb wave mode (S0) in c-oriented AlN membranes on Si, were fabricated and subsequently tested for their power handling capabilities in a feedback-loop power oscillator circuit. The S0 Lamb waves were excited and detected by a classical two-port resonator structure, as in Rayleigh SAW (RSAW) resonators. Incident power levels of up to 24 dBm (250 mW) for the FPARs were provided by a high-power sustaining amplifier in the loop. No measurable performance degradation was observed. The results from this study indicate that IC-compatible S0 FPAR devices can dissipate orders of magnitude higher RF-power levels than their RSAW counterparts on quartz and are well suited for integrated microwave power oscillators with thermal noise floor (TNF) levels below -175 dBc/Hz.
Keywords :
aluminium compounds; feedback oscillators; integrated circuits; microwave oscillators; piezoelectric materials; silicon; surface acoustic wave resonators; surface acoustic waves; thin film devices; AlN; FPAR devices; IC compatible power oscillators; RSAW resonators; Rayleigh SAW resonators; S0 Lamb wave excitation; Si; c oriented aluminium nitride membranes; classical two port resonator structure; feedback loop power oscillator circuit; frequency 880 MHz; integrated microwave power oscillators; low order fast symmetric Lamb wave mode; power handling capability; silicon substrate; thermal noise floor; thin film plate acoustic resonators; Acoustic devices; Acoustic testing; Biomembranes; Circuit testing; Feedback circuits; High power amplifiers; Oscillators; Surface acoustic waves; Thin film circuits; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
ISSN :
1948-5719
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
Type :
conf
DOI :
10.1109/ULTSYM.2009.5441502
Filename :
5441502
Link To Document :
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