DocumentCode
1993461
Title
Study of tantalum and iridium as adhesion layers for Pt/LGS high temperature SAW devices
Author
Aubert, Thierry ; Elmazria, Omar ; Assouar, Badreddine ; Bouvot, Laurent ; Bournebe, Zoumnone ; Hehn, Michel ; Weber, Sylvain ; Oudich, Mourad ; Alnot, Patrick
Author_Institution
Inst. Jean Lamour, Nancy Univ., Vandoeuvre les Nancy, France
fYear
2009
fDate
20-23 Sept. 2009
Firstpage
1672
Lastpage
1675
Abstract
In this paper, we report on the use of tantalum and iridium as adhesion layers for platinum electrodes used in high temperature SAW devices based on langasite substrates (LGS). Unlike iridium, tantalum exhibits a great adhesive strength, and a very low mobility through the Pt film, ensuring a device lifetime of at least half an hour at 1000°C. The latter is limited by morphological modifications of platinum, starting by the apparition of crystallites on the surface, and followed by important terracing and breaking of the film continuity. SNMS and XRD measurements allowed us to show that these phenomena are likely intrinsic to platinum film, whatever be the nature of the adhesion layer. Finally, after having outlined a possible scenario leading to this deterioration, we consider some solutions that could replace platinum in order to increase the lifetime of LGS-based SAW devices in high temperatures conditions.
Keywords
X-ray diffraction; adhesion; crystallites; electrodes; high-temperature techniques; iridium; platinum; surface acoustic wave devices; tantalum; La3Ga5SiO14; Pt-Ir-La3Ga5SiO14; Pt-Ta-La3Ga5SiO14; X-ray diffraction; adhesion layer; crystallite apparition; device lifetime; electrodes; film continuity breaking; film continuity terracing; high temperature SAW device; langasite substrate; temperature 1000 degC; Adhesives; Electrodes; Optical films; Platinum; Stability; Substrates; Surface acoustic wave devices; Temperature sensors; Titanium; Zirconium; SAW; high temperature; langasite; platinum; tantalum;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location
Rome
ISSN
1948-5719
Print_ISBN
978-1-4244-4389-5
Electronic_ISBN
1948-5719
Type
conf
DOI
10.1109/ULTSYM.2009.5441517
Filename
5441517
Link To Document