• DocumentCode
    1993461
  • Title

    Study of tantalum and iridium as adhesion layers for Pt/LGS high temperature SAW devices

  • Author

    Aubert, Thierry ; Elmazria, Omar ; Assouar, Badreddine ; Bouvot, Laurent ; Bournebe, Zoumnone ; Hehn, Michel ; Weber, Sylvain ; Oudich, Mourad ; Alnot, Patrick

  • Author_Institution
    Inst. Jean Lamour, Nancy Univ., Vandoeuvre les Nancy, France
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    1672
  • Lastpage
    1675
  • Abstract
    In this paper, we report on the use of tantalum and iridium as adhesion layers for platinum electrodes used in high temperature SAW devices based on langasite substrates (LGS). Unlike iridium, tantalum exhibits a great adhesive strength, and a very low mobility through the Pt film, ensuring a device lifetime of at least half an hour at 1000°C. The latter is limited by morphological modifications of platinum, starting by the apparition of crystallites on the surface, and followed by important terracing and breaking of the film continuity. SNMS and XRD measurements allowed us to show that these phenomena are likely intrinsic to platinum film, whatever be the nature of the adhesion layer. Finally, after having outlined a possible scenario leading to this deterioration, we consider some solutions that could replace platinum in order to increase the lifetime of LGS-based SAW devices in high temperatures conditions.
  • Keywords
    X-ray diffraction; adhesion; crystallites; electrodes; high-temperature techniques; iridium; platinum; surface acoustic wave devices; tantalum; La3Ga5SiO14; Pt-Ir-La3Ga5SiO14; Pt-Ta-La3Ga5SiO14; X-ray diffraction; adhesion layer; crystallite apparition; device lifetime; electrodes; film continuity breaking; film continuity terracing; high temperature SAW device; langasite substrate; temperature 1000 degC; Adhesives; Electrodes; Optical films; Platinum; Stability; Substrates; Surface acoustic wave devices; Temperature sensors; Titanium; Zirconium; SAW; high temperature; langasite; platinum; tantalum;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441517
  • Filename
    5441517