• DocumentCode
    1994906
  • Title

    A nano-composite polyamide imide passivation for 10 kV power electronics modules

  • Author

    Zhou, Jinchang ; Ang, Simon ; Mantooth, Alan ; Balda, Juan C.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Arkansas, Fayetteville, AR, USA
  • fYear
    2012
  • fDate
    15-20 Sept. 2012
  • Firstpage
    4262
  • Lastpage
    4266
  • Abstract
    High current and voltage handling capabilities are desired in many high-performance power electronic modules. One of the main challenges when integrating a power module is having a high-voltage insulation material that is reliable at all operating temperatures. In this work, the use of a polyamide imide (PAI) material as the high-voltage passivation for the power electronic modules was investigated. The power modules were integrated with a two-step passivation-encapsulation process using the PAI material. The fabricated modules were tested up to 10 kV to evaluate the material insulation properties.
  • Keywords
    composite insulating materials; encapsulation; filled polymers; modules; nanocomposites; passivation; power electronics; PAI material; encapsulation process; high current handling capability; high-voltage insulation material; high-voltage two-step passivation; nano-composite polyamide imide passivation; power electronics module; voltage 10 kV; voltage handling capability; Dielectric breakdown; Films; Insulation; Multichip modules; Passivation; Power electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2012 IEEE
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4673-0802-1
  • Electronic_ISBN
    978-1-4673-0801-4
  • Type

    conf

  • DOI
    10.1109/ECCE.2012.6342243
  • Filename
    6342243