Title :
A nano-composite polyamide imide passivation for 10 kV power electronics modules
Author :
Zhou, Jinchang ; Ang, Simon ; Mantooth, Alan ; Balda, Juan C.
Author_Institution :
Dept. of Electr. Eng., Univ. of Arkansas, Fayetteville, AR, USA
Abstract :
High current and voltage handling capabilities are desired in many high-performance power electronic modules. One of the main challenges when integrating a power module is having a high-voltage insulation material that is reliable at all operating temperatures. In this work, the use of a polyamide imide (PAI) material as the high-voltage passivation for the power electronic modules was investigated. The power modules were integrated with a two-step passivation-encapsulation process using the PAI material. The fabricated modules were tested up to 10 kV to evaluate the material insulation properties.
Keywords :
composite insulating materials; encapsulation; filled polymers; modules; nanocomposites; passivation; power electronics; PAI material; encapsulation process; high current handling capability; high-voltage insulation material; high-voltage two-step passivation; nano-composite polyamide imide passivation; power electronics module; voltage 10 kV; voltage handling capability; Dielectric breakdown; Films; Insulation; Multichip modules; Passivation; Power electronics;
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2012 IEEE
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4673-0802-1
Electronic_ISBN :
978-1-4673-0801-4
DOI :
10.1109/ECCE.2012.6342243
