Integrated half-bridge switch using 70µm thin devices and hollow interconnects

An application oriented integration concept for half-bridge switch assembly has been developed based on the latest generation Infineon Technologies 70um thin IGBTs and diodes, rated at 200A/600V. This paper addresses the thermo-mechanical simulation to optimize the designed assembly along with three different cylinderical bump shapes for reducing the stress and creep strain development in the solder joints. The simulation results show that effect of the bump shape on thermal performance is negligible, however thin hollow cylinder type can reduce the creep strain accumulation in the solder joints as compared to solid and thick cylinder bumps. A preliminary experimental test was also carried out and the functionality of the assembly was demonstrated.