• DocumentCode
    1995081
  • Title

    Non-particulate static dissipative polymers used in wafer handling equipment

  • Author

    Tan, Wayne

  • Author_Institution
    Advanced Micro Devices #1 AMD Place, Sunnyvale, California 94088
  • fYear
    1997
  • fDate
    25-25 Sept. 1997
  • Firstpage
    49
  • Lastpage
    58
  • Abstract
    With the advance of polymer technology, more and more static safe materials that are free of particulate additives have been used in building the wafer handling equipment. This paper reviews the potential electrostatic problems with the manual and semi-automatic wafer handling process and various solutions using non-sloughing particulate and non-p(articu1ate static dissipative polymers at strategic locations on the equipment and tools.
  • Keywords
    Additives; Chemicals; Cleaning; Conductivity; Contamination; Electrostatic discharge; Fabrication; Plastic insulation; Polymers; Sparks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium,1997. Proceedings
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    1-878303-69-4
  • Type

    conf

  • DOI
    10.1109/EOSESD.1997.634225
  • Filename
    634225
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1995081