DocumentCode :
1995516
Title :
A New Method to Reduce the Side-Channel Leakage Caused by Unbalanced Capacitances of Differential Interconnections in Dual-Rail Logic Styles
Author :
Quan, Jianping ; Bai, Guoqiang
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing
fYear :
2009
fDate :
27-29 April 2009
Firstpage :
58
Lastpage :
63
Abstract :
Recently DPA resistant logic styles are of great concern. As far as we know, each kind of logic style has its own drawbacks. Masking logic styles can easily be attacked by the template attack. For dual-rail logic styles, TDPL can only keep the total power consumption of the whole cycle constant; as for WDDL, it becomes more and more difficult to efficiently match the interconnect capacitances of differential wires with shrinking feature sizes. To avoid these drawbacks, we present a new direction for routing effort to solve the unbalanced interconnection problem. By using three-phase logic and removing the load dependent power consumption in the evaluation phase and discharge phase, our logic style is insensitive to the unbalanced interconnect capacitances of differential wires. Additionally, the early propagation effect is another threat to certain DPA resistant logic styles. We also propose a theoretical method to solve it at the system level.
Keywords :
capacitance; integrated circuit interconnections; integrated logic circuits; logic design; network routing; DPA resistant logic style; differential interconnection; differential power analysis; differential wires; dual-rail logic style; interconnect capacitances; power consumption; propagation effect; routing effort; side-channel leakage; three-phase dual-rail precharge logic; three-phase logic; unbalanced capacitance; Capacitance; Clocks; Energy consumption; Information technology; Logic; Microelectronics; Power measurement; Power system interconnection; Routing; Wires; NSDDL; TDPL; WDDL; early propagation effect; routing; unbalanced interconnections;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information Technology: New Generations, 2009. ITNG '09. Sixth International Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-3770-2
Electronic_ISBN :
978-0-7695-3596-8
Type :
conf
DOI :
10.1109/ITNG.2009.185
Filename :
5070593
Link To Document :
بازگشت