DocumentCode :
1995672
Title :
Effect of surface acoustic waves on curing of polyimide films
Author :
Yin, Ching-Chung ; Chang, I-Han ; Huang, Kang-Che
Author_Institution :
Dept. of Mech. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2009
fDate :
20-23 Sept. 2009
Firstpage :
815
Lastpage :
818
Abstract :
This paper presents the surface acoustic wave (SAW) mediated realignment for molecular orientation of polyimide films in curing process. The order parameters of polyimide films were obtained by measuring the anisotropic infrared absorbance using polarized infrared absorption spectroscopy. Experimental results of the double layered specimens indicated that the monomer chains were aligned to parallel to the wave fronts of SAW. The double layered specimens were made of a well cured polyimide film subsequently coated with the second film. The first film provides attractive forces to anchor the molecules of the second polyimide film on the first film. In the present experiments, the molecular orientation order parameter of SAW processed polyimide film is 0.23. It is between the values of unrubbed film (0.069) and rubbed one (0.535).
Keywords :
acoustic applications; acoustic streaming; curing; infrared spectra; molecular reorientation; polymer films; radiation pressure; surface acoustic waves; SAW effetcs; SAW mediated realignment; SAW wave front; aligned monomer chains; anisotropic infrared absorbance; polarised infrared absorption spectroscopy; polyimide film curing; polyimide film molecular orientation; polyimide film order parameter; surface acoustic wave; Acoustic measurements; Acoustic waves; Anisotropic magnetoresistance; Curing; Electromagnetic wave absorption; Infrared spectra; Polarization; Polyimides; Spectroscopy; Surface acoustic waves; FTIR; alignment layer; molecular orientation; polyimide; surface acoustic wave;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
ISSN :
1948-5719
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
Type :
conf
DOI :
10.1109/ULTSYM.2009.5441608
Filename :
5441608
Link To Document :
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