• DocumentCode
    1996066
  • Title

    Modeling and Design Considerations for Substrate Integrated Waveguide Circuits and Components

  • Author

    Bozzi, Maurizio ; Xu, Feng ; Deslandes, Dominic ; Wu, Ke

  • Author_Institution
    Univ. of Pavia, Pavia
  • fYear
    2007
  • fDate
    26-28 Sept. 2007
  • Abstract
    This paper presents an overview of the recent achievements in the held of substrate integrated waveguides (SIW) technology, with particular emphasis on the modeling strategy and design considerations of millimeter-wave integrated circuits as well as the physical interpretation of the operation principles and loss mechanisms of these structures. The most common numerical methods for modeling both SIW interconnects and circuits are presented. Some considerations and guidelines for designing SIW structures, interconnects and circuits are discussed, along with the physical interpretation of the major issues related to radiation leakage and losses. Examples of SIW circuits and components operating in the microwave and millimeter wave bands are also reported, with numerical and experimental results.
  • Keywords
    finite difference time-domain analysis; integrated circuit design; millimetre wave circuits; waveguides; method of moments; millimeter-wave integrated circuits; radiation leakage; substrate integrated waveguide circuits; Guidelines; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit technology; Microwave circuits; Millimeter wave circuits; Millimeter wave integrated circuits; Millimeter wave technology; Numerical models; Waveguide components; Finite-difference time domain (FDTD) method; guided wave; leakage; method of moments (MoM); periodic structures; substrate integrated waveguide (SIW);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications in Modern Satellite, Cable and Broadcasting Services, 2007. TELSIKS 2007. 8th International Conference on
  • Conference_Location
    Serbia
  • Print_ISBN
    978-1-4244-1467-3
  • Electronic_ISBN
    978-1-4244-1468-0
  • Type

    conf

  • DOI
    10.1109/TELSKS.2007.4375921
  • Filename
    4375921