Title :
A study of time stability of piezoelectricity in porous polypropylene electrets
Author :
Kodama, Hidekazu ; Yasuno, Yoshinobu ; Date, Munehiro ; Fukada, Eiichi
Author_Institution :
Kobayasi Inst. of Phys. Res., Kokubunji, Japan
Abstract :
Time stability of piezoelectricity in porous polypropylene (PP) electrets was studied. Piezoelectric e33 and d33 constants and the electromechanical coupling factor kt were evaluated by dielectric resonance method. The amount of storage charge and its temperature stability were measured by short circuit TSD measurement. The experimental results showed e33, d33 and kt decreased after a day passed from charging and became stable after that. The TSD spectra showed three peaks at 65°C, 90°C and 120°C. The decrease of piezoelectricity was in correspond with a decrease of TSD peak at 65°C. Temperature spectra of Young´s modulus and permittivity showed Ã-relaxation around 10°C and ¿-relaxation around 100°C. The peak temperatures of TSD were covered with the temperature range of ¿-relaxation in a crystal region of PP. Airborne ultrasonic transducer using the porous PP electrets showed the maximum SPL of 95 dB at 150 kHz.
Keywords :
Young´s modulus; electrets; permittivity; piezoelectricity; polymers; thermally stimulated currents; ultrasonic transducers; Young´s modulus; airborne ultrasonic transducer; dielectric resonance method; electromechanical coupling factor; permittivity; piezoelectric constant; piezoelectricity; porous polypropylene electrets; short circuit TSD measurement; storage charge; temperature 120 degC; temperature 65 degC; temperature 90 degC; temperature stability; time stability; ¿-relaxation; Ã\x9f-relaxation; Charge measurement; Coupling circuits; Current measurement; Dielectric measurements; Electrets; Piezoelectricity; Resonance; Stability; Temperature distribution; Temperature measurement; Airborne Ultrasonic Transducer; Dielectric Resonance; Electrets; Piezoelectricity; Porous Polypropylene; Thermal Stimulated Discharge;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441637