Title :
Realization of small and low profile Duplexer using a CSSD packaging technology
Author :
Nishizawa, T. ; Endo, G. ; Tajima, M. ; Ono, S. ; Kawachi, O.
Author_Institution :
Fujitsu Media Devices Ltd., Yokohama, Japan
Abstract :
This paper presents the realization of Duplexer with small size, high reliability and excellent performance. Good heat radiation, hermetic performance and small frequency drift against temperature shift are essential to achieve small size and highly reliable Duplexers. In this paper, we will report on the advantage of the Chip Size SAW Devices (CSSD) structure for miniaturization and high reliability. In addition, we will discuss the possibility of further miniaturization.
Keywords :
heat radiation; radio equipment; CSSD packaging technology; chip size SAW devices structure; frequency drift; heat radiation; hermetic performance; low profile duplexer; temperature shift; Chip scale packaging; GSM; Integrated circuit reliability; Multiaccess communication; Radio frequency; Surface acoustic wave devices; Surface acoustic waves; Temperature control; Testing; Thermal conductivity; CSSD; Duplexers; SAW;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441641
