DocumentCode
1996803
Title
Discussion of millimeter wave FBAR with very thin AlN film fabricated using MOCVD method
Author
Tanifuji, Shoichi ; Aota, Yuji ; Kameda, Suguru ; Takagi, Tadashi ; Tsubouchi, Kazuo
Author_Institution
Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
fYear
2009
fDate
20-23 Sept. 2009
Firstpage
2170
Lastpage
2173
Abstract
We discuss millimeter-wave film bulk acoustic resonator (FBAR) with very thin aluminium nitride (AlN) film fabricated using metal organic chemical vapor deposition (MOCVD) method. In previous works, we have successfully grown c-axis oriented AlN film using MOCVD method on Ru/Ta/SiO2/Si substrate. In this paper, we grew excellent orientation films of AlN and Ru electrodes in MOCVD, although their film thickness were very thin. Experimental results show that full width at half maximum (FWHM) is 1.3° at AlN thickness of 30 nm. In calculating analysis, when both top and bottom electrode thicknesses were 20 nm and AlN thickness was 30 nm, we obtained that resonant frequency was higher than 50 GHz. Therefore, FBAR is possible to apply to millimeter-wave bands devices, also contribute to small-size, low power consumption and low cost for millimeter-wave terminals.
Keywords
III-V semiconductors; MOCVD; acoustic resonators; aluminium compounds; bulk acoustic wave devices; millimetre wave devices; semiconductor thin films; wide band gap semiconductors; AlN; AlN electrode; MOCVD method; Ru electrode; aluminium nitride film; film bulk acoustic resonator; film thickness; low power consumption; metal organic chemical vapor deposition; millimeter wave FBAR; millimeter-wave terminal; thin film orientation; Aluminum; Chemical vapor deposition; Electrodes; Film bulk acoustic resonators; MOCVD; Millimeter wave technology; Organic chemicals; Resonant frequency; Semiconductor films; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location
Rome
ISSN
1948-5719
Print_ISBN
978-1-4244-4389-5
Electronic_ISBN
1948-5719
Type
conf
DOI
10.1109/ULTSYM.2009.5441657
Filename
5441657
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