• DocumentCode
    1996803
  • Title

    Discussion of millimeter wave FBAR with very thin AlN film fabricated using MOCVD method

  • Author

    Tanifuji, Shoichi ; Aota, Yuji ; Kameda, Suguru ; Takagi, Tadashi ; Tsubouchi, Kazuo

  • Author_Institution
    Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    2170
  • Lastpage
    2173
  • Abstract
    We discuss millimeter-wave film bulk acoustic resonator (FBAR) with very thin aluminium nitride (AlN) film fabricated using metal organic chemical vapor deposition (MOCVD) method. In previous works, we have successfully grown c-axis oriented AlN film using MOCVD method on Ru/Ta/SiO2/Si substrate. In this paper, we grew excellent orientation films of AlN and Ru electrodes in MOCVD, although their film thickness were very thin. Experimental results show that full width at half maximum (FWHM) is 1.3° at AlN thickness of 30 nm. In calculating analysis, when both top and bottom electrode thicknesses were 20 nm and AlN thickness was 30 nm, we obtained that resonant frequency was higher than 50 GHz. Therefore, FBAR is possible to apply to millimeter-wave bands devices, also contribute to small-size, low power consumption and low cost for millimeter-wave terminals.
  • Keywords
    III-V semiconductors; MOCVD; acoustic resonators; aluminium compounds; bulk acoustic wave devices; millimetre wave devices; semiconductor thin films; wide band gap semiconductors; AlN; AlN electrode; MOCVD method; Ru electrode; aluminium nitride film; film bulk acoustic resonator; film thickness; low power consumption; metal organic chemical vapor deposition; millimeter wave FBAR; millimeter-wave terminal; thin film orientation; Aluminum; Chemical vapor deposition; Electrodes; Film bulk acoustic resonators; MOCVD; Millimeter wave technology; Organic chemicals; Resonant frequency; Semiconductor films; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441657
  • Filename
    5441657