Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application

Structures for interconnecting active microwave semiconductor-devices, e.g. FET´s and MIC´s, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz was considered. Additionally, different equivalent circuits were developed to approximately describe their behaviour for CAD-applications.