• DocumentCode
    1996830
  • Title

    Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application

  • Author

    Christ, A. ; Hartnagel, H.L.

  • fYear
    1987
  • fDate
    7-11 Sept. 1987
  • Firstpage
    647
  • Lastpage
    652
  • Abstract
    Structures for interconnecting active microwave semiconductor-devices, e.g. FET´s and MIC´s, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz was considered. Additionally, different equivalent circuits were developed to approximately describe their behaviour for CAD-applications.
  • Keywords
    Design automation; Equivalent circuits; FETs; Finite difference methods; Frequency; Integrated circuit interconnections; Joining processes; Microwave devices; Microwave integrated circuits; Semiconductor device packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1987. 17th European
  • Conference_Location
    Rome, Italy
  • Type

    conf

  • DOI
    10.1109/EUMA.1987.333680
  • Filename
    4132414
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1996830