DocumentCode
1998356
Title
A flexible capacitive micromachined ultrasonic transducer (CMUT) array with increased effective capacitance from concave bottom electrodes for ultrasonic imaging applications
Author
Cheng, Ching-Hsiang ; Chao, Chen ; Shi, Xiaomei ; Leung, Wallace W F
Author_Institution
Res. Inst. of Innovative Products & Technol. (RIIPT), Hong Kong Polytech. Univ., Kowloon, China
fYear
2009
fDate
20-23 Sept. 2009
Firstpage
996
Lastpage
999
Abstract
A flexible capacitive micromachined ultrasonic transducer (CMUT) array with increased effective capacitance from concave bottom electrodes is proposed for ultrasonic imaging. A CMUT can transmit and receive ultrasound by vibrating its membrane like a drum. DC bias is applied to bring the membrane closer to the bottom electrode for increasing its sensitivity. However, most of the developed CMUTs have flat bottom electrode, which can not comply with the deflected membrane in a concave surface. Since the capacitance is inverse-proportional to the gap distance between the electrodes, this makes only the 25% central area more sensitive to the capacitance change and the other 75% of the area is considered as parasitic capacitance without coverage of the top electrode. Based on the theoretical analysis, when using concave bottom electrode to reduce the gap distance around the membrane edge, the effective capacitance can increase 10 times comparing with using the flat bottom electrode. The concave bottom electrode is formed on top of the reflowed photoresist in convex spherical shape using over-plating technique. By using the concave bottom electrode to increase the effective area of the membrane, it can increase the effective capacitance to improve the fill factor, output pressure, bandwidth, and sensitivity of the transducer.
Keywords
capacitive sensors; electrodes; micromachining; sensitivity; ultrasonic transducer arrays; CMUT array; DC bias; capacitance change; concave bottom electrodes; concave surface; convex spherical shape; effective capacitance; electrode gap distance; fill factor; flexible capacitive micromachined ultrasonic transducer; membrane sensitivity; output pressure; over-plating technique; parasitic capacitance; photoresist; transducer sensitivity; ultrasonic imaging application; ultrasound reception; ultrasound transmission; Biomembranes; Electrodes; Fabrication; Parasitic capacitance; Polymers; Silicon; Temperature; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; CMUT; Capacitive Micromachined Ultrasonic Transducer; Concave Bottom Electrode; Effective Capacitance; Ultrasonic Imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location
Rome
ISSN
1948-5719
Print_ISBN
978-1-4244-4389-5
Electronic_ISBN
1948-5719
Type
conf
DOI
10.1109/ULTSYM.2009.5441724
Filename
5441724
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