Title :
Time Domain Performance on Advanced Packaging for High Speed ICs on GaAs
Author :
Razban, T. ; Chilo, J.
Author_Institution :
ENSERG-LEMO: 23 Avenue des Martyrs 38031 GRENOBLE Cédex FRANCE. Tel: (33) 76.87.69.76 Fax: (33) 76.43.37.96
Abstract :
Delay time and crosstalk phenomena in packages for GaAs ICs are discussed in this paper. Interconnection lines between the "chip" and the exterior world are non-uniformly coupled lines; for analyzing such a system, we define the characteristics of a tube being a group of uniformly coupled lines. A system of non-uniformly coupled lines is divided into cascaded tubes. Theoretical results are compared to experimental ones.
Keywords :
Coupling circuits; Crosstalk; Delay effects; Gallium arsenide; Impedance; Integrated circuit interconnections; Integrated circuit packaging; Joining processes; Stripline; Time domain analysis;
Conference_Titel :
Microwave Conference, 1988. 18th European
Conference_Location :
Stockholm, Sweden
DOI :
10.1109/EUMA.1988.333820
