DocumentCode :
1999112
Title :
Non invasive measurement of skin hydration and transepidermal water loss in normal skin
Author :
Mohamad, Md ; Msabbri, A.R. ; MatJafri, Mohd Zubir
Author_Institution :
Sch. of Phys., Univ. Sains Malaysia, Minden, Malaysia
fYear :
2012
fDate :
3-4 Dec. 2012
Firstpage :
859
Lastpage :
862
Abstract :
Non invasive bioengineering techniques have been used to evaluate Stratum Corneum (SC) hydration and Transepidermal Water Loss (TEWL) in normal skin. Fifteen healthy volunteers aged between 21-27 participated in this study. We conducted a self skin evaluation questionnaire and a noninvasive measurement was performed on the palm, forearm, upper arm and forehead under controlled environment (temperature 21 ± 1 °C, relative humidity 45 ± 5%). Skin hydration was measured with a DermaLab® USB Moisture Module (Cortex Technology, Hadsund, Denmark) and Scalar Moisture Checker MY-808S (Scalar Corporation, Japan) while TEWL measurements were determined using a DermaLab® USB TEWL Module. The areas examined showed skin hydration and TEWL was differed depending on the anatomical sites. The correlations between the parameters were analysed. As a result, no significant correlations between TEWL and skin hydration capacitance were observed. A significant correlation was established between TEWL and conductance.
Keywords :
biomedical engineering; biomedical equipment; biomedical measurement; capacitance; electric admittance; skin; solvation; water; DermaLab USB Moisture Module; DermaLab USB TEWL Module; Scalar Moisture Checker MY-808S; TEWL measurements; age 21 yr to 27 yr; anatomical sites; conductance; forearm; forehead; healthy volunteers; noninvasive bioengineering techniques; noninvasive skin hydration measurement; normal skin; palm; relative humidity; self-skin evaluation questionnaire; skin hydration capacitance; stratum corneum hydration; temperature 21 degC; transepidermal water loss; upper arm; Skin hydration; Stratum Corneum (SC); Transepidermal Water Loss (TEWL);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Humanities, Science and Engineering (CHUSER), 2012 IEEE Colloquium on
Conference_Location :
Kota Kinabalu
Print_ISBN :
978-1-4673-4615-3
Type :
conf
DOI :
10.1109/CHUSER.2012.6504435
Filename :
6504435
Link To Document :
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