DocumentCode
1999226
Title
Effect of annealing gas ratio for low resistance p — type ZnO formation
Author
Hamid, Hanizah Ab ; Yusoff, Mohd Zulfadli Mohamed ; Zawawi, S.A.
Author_Institution
Dept. of Appl. Sci., Univ. Teknol. MARA, Permatang Pauh, Malaysia
fYear
2012
fDate
3-4 Dec. 2012
Firstpage
879
Lastpage
881
Abstract
Codoped ZnO thin films were prepared on silicon (111) substrates by cosputtering of aluminium rods and zinc target using DC magnetron sputtering followed by heat treatment at 300°C for 1 hour at different ratios of oxygen and nitrogen gas. Results indicated that the co doped p-type ZnO had the lowest resistivity of 3.412 × 10-3 Ω.cm with a carrier concentration of 1.54 × 1022 cm-3.
Keywords
II-VI semiconductors; aluminium; annealing; carrier density; electrical resistivity; nitrogen; semiconductor doping; semiconductor thin films; sputter deposition; wide band gap semiconductors; zinc compounds; DC magnetron sputtering; Si; ZnO; aluminium rod target; annealing gas ratio; carrier concentration; codoping; heat treatment; low resistance p-type zinc oxide; nitrogen gas; oxygen gas; resistivity; silicon (111) substrates; temperature 300 degC; thin films; time 1 h; zinc target; nitrogen; oxygen; sputtering; zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Humanities, Science and Engineering (CHUSER), 2012 IEEE Colloquium on
Conference_Location
Kota Kinabalu
Print_ISBN
978-1-4673-4615-3
Type
conf
DOI
10.1109/CHUSER.2012.6504440
Filename
6504440
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