• DocumentCode
    1999314
  • Title

    Hygrothermal ageing of a filled epoxy resin: Measurements of the insulation properties and qualitative modelling

  • Author

    Rain, Pascal ; Brun, E. ; Guillermin, C. ; Rowe, S.

  • Author_Institution
    Grenoble Electr. Eng. Lab. (G2Elab), Univ. of Grenoble, Grenoble, France
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Samples of epoxy filled with silica have been subjected to hygrothermal aging at 80°C and 80% relative humidity for several months. These samples were characterized by the measurements of resistances, partial discharges and breakdown voltages. Results for both silanized and non-silanized fillers were obtained. After ageing, large differences were observed in both breakdown voltage and resistance. The breakdown voltage was reduced by a factor of 10 after 74 days of ageing without silanization whereas the decrease was a factor of 2 with silanized fillers. The resistance was reduced by more than 4 decades in the former case and one decade in the second case. The breakdown was preceded by the occurrence of partial discharges. Partial Discharges Inception Voltage (PDIV) dropped by a factor of 10 between 32 days and 74 days of ageing. The PDIV was sensitive to the sample temperature: it was lower at larger temperatures. Partial Discharges (PD) patterns suggest that the discharges occurred in gaseous cavities. Based upon these measurements, a model of breakdown phenomenon based upon cavities filled of water vapour is proposed and discussed.
  • Keywords
    ageing; epoxy insulation; partial discharges; PDIV; breakdown phenomenon; breakdown voltages; filled epoxy resin; hygrothermal ageing; insulation properties; nonsilanized fillers; partial discharges; partial discharges inception voltage; qualitative modelling; Dielectrics; Solids; ageing; aging; breakdown; composite; epoxy; hygrothermal ageing; hygrothermal aging; partial discharge; water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5567864
  • Filename
    5567864