• DocumentCode
    1999375
  • Title

    1 Giga bit SOI DRAM with fully bulk compatible process and body-contacted SOI MOSFET structure

  • Author

    Yo-Hwan Koh ; Min-Rok Oh ; Jong-Wook Lee ; Ji-Woon Yang ; Won-Chang Lee ; Chan-Kwang Park ; Jae-Beom Park ; Yeon-Cheol Heo ; Kwang-Myung Rho ; Byung-Cheol Lee ; Myung-Jun Chung ; Min Huh ; Hyung-Suk Kim ; Kyung-Suk Choi ; Won-Chul Lee ; Jeong-Kug Lee ; Kw

  • Author_Institution
    Semicond. Res. Div., Hyundai Electron. Ind. Co. Ltd., Kyoungki, South Korea
  • fYear
    1997
  • fDate
    10-10 Dec. 1997
  • Firstpage
    579
  • Lastpage
    582
  • Abstract
    1 Gbit SOI DRAM with a body-contacted (BC) SOI MOSFET structure is successfully realized for the first time. The fabricated 1G SOI DRAM has fully compatible process with 0.17 /spl mu/m bulk CMOS technology except for the isolation process. The key advantage of BC-SOI MOSFET is freedom from the floating-body effect, since the body-potential increase can be suppressed by the well contact through the remaining thin-silicon film beneath the field oxide. The BC-SOI structure has several advantages, such as relatively high isolation punchthrough voltage, high drain-to-source breakdown voltage compared with conventional thin-film SOI MOSFETs and small junction capacitance compared with bulk MOSFETs, resulting in high-speed circuit operation.
  • Keywords
    CMOS memory circuits; DRAM chips; capacitance; electric breakdown; isolation technology; silicon-on-insulator; 0.17 micron; 1 Gbit; CMOS technology; Si; body-contacted SOI MOSFET structure; floating-body effect elimination; fully bulk compatible process; gigabit SOI DRAM; high drain-to-source breakdown voltage; high-speed circuit operation; isolation punchthrough voltage; junction capacitance; well contact; Breakdown voltage; CMOS process; CMOS technology; Electronics industry; Isolation technology; MOSFET circuits; Random access memory; Semiconductor films; Silicon; Thin film circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4100-7
  • Type

    conf

  • DOI
    10.1109/IEDM.1997.650451
  • Filename
    650451