DocumentCode
1999544
Title
Reliability of 4H-SiC SBD/JBS diodes under repetitive surge current stress
Author
Huang, Xing ; Wang, Gangyao ; Lee, Meng-Chia ; Huang, Alex Q.
Author_Institution
Future Renewable Electr. Energy Delivery & Manage. Syst. Center, North Carolina State Univ., Raleigh, NC, USA
fYear
2012
fDate
15-20 Sept. 2012
Firstpage
2245
Lastpage
2248
Abstract
The reliability of power diode under surge current stress is crucial to the applications like motor drives. In this paper, the single and repetitive surge reliability of the 4H-SiC Schottky Barrier Diodes (SBDs) and Junction Barrier Schottky (JBS) diodes have been tested and the corresponding failure mechanisms studied. The single surge test results of two SBDs and three JBS didoes suggest a 450W/mm2 constant power line of the safe operation area for single surge current with a half sinusoidal pulse width of 8.3ms. The stress tests show no degradation of SBDs up to 10,000 cycles of surge current below 34.9A/mm2. The JBS diodes show VF degradation after surge stress at different current levels, which might be dependent on the hole injection levels. The aluminum metallization and bipolar degradation are the main limits for the reliability of SiC diodes under surge conditions.
Keywords
Schottky diodes; failure analysis; power cables; power system reliability; silicon compounds; surge protection; 4H-SiC JBS diode; 4H-SiC SBD diode; Schottky barrier diode; SiC; aluminum metallization; bipolar degradation; constant power line; failure mechanism; junction barrier Schottky diode; motor drive; power diode reliability; repetitive surge current stress; surge current; time 8.3 ms; Degradation; Reliability; Schottky diodes; Silicon carbide; Stress; Surges;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition (ECCE), 2012 IEEE
Conference_Location
Raleigh, NC
Print_ISBN
978-1-4673-0802-1
Electronic_ISBN
978-1-4673-0801-4
Type
conf
DOI
10.1109/ECCE.2012.6342436
Filename
6342436
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