Comparison of crosstalk delay between single and bundled SWNT for global VLSI interconnects

Carbon nanotubes (CNTs) have been proved as an emerging interconnect material for future nano and deep submicron level technologies. CNTs are more advantageous than copper or other interconnect materials because of their robustness to electromigration. In this paper, single-wall CNT (SWNT)-based interconnects are modeled and the effects of crosstalk are evaluated. On comparing the crosstalk effects for different models of single SWNT and bundled SWNT, it is observed that crosstalk delay is significantly reduced for SWNT bundles at global level of interconnects. Irrespective of the types of SWNTs, crosstalk delay is extensively affected by transition time, diameter of SWNTs and spacing between two lines (aggressor and victim).