• DocumentCode
    2000730
  • Title

    Terahertz spectroscopy and imaging for material analysis in conservation science

  • Author

    Fukunaga, Kaori ; Hosako, Iwao ; Picollo, Marcello

  • Author_Institution
    Nat. Inst. of Inf. & Commun. Technol., Koganei, Japan
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Terahertz (THz) waves can penetrate opaque materials and fingerprint spectra appear as those in infrared bands. The technique is expected to be used as a new non-invasive analysis method for various materials. Time domain reflection imaging, in particular, uses THz pulses that propagate in specimens, and in this technique, pulses reflected from the internal boundaries of the specimen indicate the internal structure. We have developed a spectral database of painting materials, and applied THz time domain imaging for analysis of artworks. Experimental results, including first ever non-invasive cross section image of a tempera masterpiece, proved that THz wave can observe layer structure of the artwork from the wood support, gesso preparation layers, and the painting layer. This technique should also be useful to detect internal defect of various types of opaque dielectric materials such as multi layer insulations.
  • Keywords
    art; painting; terahertz spectroscopy; terahertz wave imaging; THz time domain imaging; artwork; conservation science; gesso preparation layers; internal defect; material analysis; multi layer insulations; opaque dielectric materials; painting materials; tempera masterpiece; terahertz imaging; terahertz spectroscopy; time domain reflection imaging; wood support; Imaging; Materials; Painting; Pigments; Reflection; Spectroscopy; Time domain analysis; cultural heritage; terahertz;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5567932
  • Filename
    5567932