• DocumentCode
    2000769
  • Title

    Experimental study on the thermal performance of water-heating wallboard with phase change material

  • Author

    Huo, Ran ; Yan, Quanying

  • Author_Institution
    Dept. of Urban Constr. Eng., Beijing Univ. of Civil Eng. & Archit., Beijing, China
  • fYear
    2011
  • fDate
    16-18 Sept. 2011
  • Firstpage
    2242
  • Lastpage
    2245
  • Abstract
    In this paper, a simple model of composite phase change material (PCM) wallboard with hot-water heating system was made. The heat transfer performance and thermal storage property of this model were studied. A proper ratio of paraffin mixture was selected and jointed into the wallboard, with a phase change temperature of 27.8 V. According to the PCM´s property of thermal storage, hot water for heating can be supplied for only 8 hours a day, and then stop the hot-water. During this process, the changing values of heat flux and temperatures on wallboard´s surface were measured all the time. The results show that jointing the PCM into active water heating building envelope can maintain the heat flux in the wallboard to a certain degree so as to avoid indoor temperature and wallboard surface temperature fluctuate effectively after hot-water supply was stopped for a relatively long period of time; PCM wallboard can be a effective method of reducing heating and saving energy used in intermittent heating; when water supplied are kept at 45 V and 55°C, PCM wallboard can release lots of heat flux to meet heating needs. Maintenance structure has a certain impact on the heat storage and release. The results in this paper can provide references and basis for the heat transfer enforcement of phase change materials used in the wall.
  • Keywords
    composite materials; heat transfer; phase change materials; space heating; thermal energy storage; composite PCM wallboard; composite phase change material wallboard; heat flux; heat transfer performance; hot-water heating system; intermittent heating; paraffin mixture ratio; temperature 27.8 degC; temperature 45 degC; temperature 55 degC; thermal performance; thermal storage property; time 8 hour; wallboard surface temperature; water-heating building envelope; Heat transfer; Phase change materials; Resistance heating; Temperature distribution; Temperature measurement; Water heating; heat transfer property; phase change material (PCM); water-heating wallboard;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Control Engineering (ICECE), 2011 International Conference on
  • Conference_Location
    Yichang
  • Print_ISBN
    978-1-4244-8162-0
  • Type

    conf

  • DOI
    10.1109/ICECENG.2011.6058311
  • Filename
    6058311