• DocumentCode
    2000936
  • Title

    Improved substrate selection for lateral field TSM sensors

  • Author

    Andle, Jeffrey C. ; Haskell, Reichl ; Chap, Maly ; Stevens, Daniel

  • Author_Institution
    SenGenuity Div., Vectron Int., Hudson, NH, USA
  • fYear
    2009
  • fDate
    20-23 Sept. 2009
  • Firstpage
    649
  • Lastpage
    654
  • Abstract
    In recent years there have been several motivations away from thickness field excitation and toward lateral field excitation for thickness shear mode (TSM) fluid phase sensors. Lateral field excitation offers an unmetallized sensor surface for electrical interactions while still providing for hermetic packaging of the driven electrodes. Historical substrate selections have supported both thickness field and lateral field excitation, incurring a hybrid operating mode and a significant issue with spurious signals. This effect is not conducive to a commercially-viable, mass-producible sensor. The objectives of this paper are to present a ground-up analysis of the ideal symmetry properties for lateral field excitation and to recommend classes of materials and proper orientations through which to obtain low-spurious lateral field excitation.
  • Keywords
    acoustic field; sensors; shear modulus; substrates; surface acoustic wave resonators; surface acoustic waves; electrical interactions; fluid phase sensors; hermetic packaging; lateral field TSM sensors; lateral field excitation; substrate selection; thickness shear mode; unmetallized sensor surface; Acoustic devices; Acoustic measurements; Acoustic sensors; Electrodes; Energy measurement; Packaging; Phase measurement; Temperature distribution; Temperature sensors; Time to market; TSM sensor; Zcut; fluid phase; langasite; lateral field excitation; sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2009 IEEE International
  • Conference_Location
    Rome
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4244-4389-5
  • Electronic_ISBN
    1948-5719
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2009.5441833
  • Filename
    5441833