DocumentCode
2000936
Title
Improved substrate selection for lateral field TSM sensors
Author
Andle, Jeffrey C. ; Haskell, Reichl ; Chap, Maly ; Stevens, Daniel
Author_Institution
SenGenuity Div., Vectron Int., Hudson, NH, USA
fYear
2009
fDate
20-23 Sept. 2009
Firstpage
649
Lastpage
654
Abstract
In recent years there have been several motivations away from thickness field excitation and toward lateral field excitation for thickness shear mode (TSM) fluid phase sensors. Lateral field excitation offers an unmetallized sensor surface for electrical interactions while still providing for hermetic packaging of the driven electrodes. Historical substrate selections have supported both thickness field and lateral field excitation, incurring a hybrid operating mode and a significant issue with spurious signals. This effect is not conducive to a commercially-viable, mass-producible sensor. The objectives of this paper are to present a ground-up analysis of the ideal symmetry properties for lateral field excitation and to recommend classes of materials and proper orientations through which to obtain low-spurious lateral field excitation.
Keywords
acoustic field; sensors; shear modulus; substrates; surface acoustic wave resonators; surface acoustic waves; electrical interactions; fluid phase sensors; hermetic packaging; lateral field TSM sensors; lateral field excitation; substrate selection; thickness shear mode; unmetallized sensor surface; Acoustic devices; Acoustic measurements; Acoustic sensors; Electrodes; Energy measurement; Packaging; Phase measurement; Temperature distribution; Temperature sensors; Time to market; TSM sensor; Zcut; fluid phase; langasite; lateral field excitation; sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location
Rome
ISSN
1948-5719
Print_ISBN
978-1-4244-4389-5
Electronic_ISBN
1948-5719
Type
conf
DOI
10.1109/ULTSYM.2009.5441833
Filename
5441833
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