DocumentCode
2001061
Title
Experimental model of a quartz/epoxy interface submitted to a hygrothermal ageing: A dielectric characterization
Author
Rain, P. ; Brun, E. ; Guillermin, C. ; Rowe, S.
Author_Institution
Grenoble Electr. Eng. Lab. (G2Elab), Univ. of Grenoble, Grenoble, France
fYear
2010
fDate
4-9 July 2010
Firstpage
1
Lastpage
4
Abstract
To investigate the hygrothermal ageing of silica/epoxy interfaces in a filled epoxy resin, a macroscopic experimental model of such interfaces has been designed. It consisted of coplanar interdigitated electrodes deposited on a quartz substrate and moulded in epoxy resin. The dielectric properties were followed at 80°C and 80% relative humidity. These properties have been compared with the evolutions under the same conditioning of sheets and mouldings of the unfilled resin. Comparisons show that the resistance of the interdigitated sample was not due to the water-enhanced resin conductivity but to the conductivity of an interphase, which has been quantified. If the interphase is modeled as a uniform water layer at the quartz/resin interface, an estimation of the water thickness in the micrometer can be deduced from the dielectric measurements. This order of magnitude can be useful to understand prebreakdown phenomena resulting from a hygrothermal ageing of composite insulations.
Keywords
ageing; composite insulating materials; dielectric measurement; dielectric properties; electric breakdown; electrodeposition; filled polymers; quartz; resins; thermal analysis; composite insulation; coplanar interdigitated electrode deposition; dielectric characterization; dielectric measurement; dielectric property; filled epoxy resin; hygrothermal ageing; interphase conductivity; macroscopic experimental model; micrometer; prebreakdown phenomena; quartz substrate; quartz-epoxy interface; relative humidity; silica-epoxy interface; temperature 80 C; uniform water layer; water thickness; water-enhanced resin conductivity; DH-HEMTs; Dielectrics; Solids; Three dimensional displays; ageing; aging; dielectric; epoxy; hygrothermal; interface; silica; water;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
Conference_Location
Potsdam
Print_ISBN
978-1-4244-7945-0
Electronic_ISBN
978-1-4244-7943-6
Type
conf
DOI
10.1109/ICSD.2010.5567948
Filename
5567948
Link To Document