Title :
Improved coupled resonator filter performance using a carbon-doped oxide de-coupling layer
Author :
Gilbert, S.R. ; Nikkel, P. ; Jamneala, T. ; Ruby, R. ; Larson, J.D., III ; Thalhammer, R.
Author_Institution :
Wireless Semicond. Div., Avago Technol., San Jose, CA, USA
Abstract :
We describe a newly developed de-coupling material SiOCH for coupled resonator filter applications. The SiOCH films belong to a general class of low-k dielectrics often referred to as carbon-doped oxides (CDO). In this work, CDO replaces SiLK, significantly improving the performance of the resulting filters. In contrast to the spin-on and curing process used to deposit SiLK, the CDO films are deposited using plasma enhanced chemical vapor deposition. The resulting films possess a low acoustic impedance that can be varied over a range greater than 2:1 through a choice of deposition conditions. The new filters possess several key advantages over the SiLK-based devices reported previously, including decreased filter insertion loss, a passband free of spurious notches, and a dramatically lower temperature coefficient of frequency.
Keywords :
acoustic impedance; acoustic resonator filters; band-pass filters; bulk acoustic wave devices; carbon; crystal resonators; doping; low-k dielectric thin films; plasma CVD; silicon compounds; acoustic impedance; carbon doped oxide; coupled resonator filter performance; curing process; decoupling layer; insertion loss; low-k dielectrics; plasma enhanced chemical vapor deposition; spin-on process; temperature coefficient of frequency; Acoustic devices; Chemical vapor deposition; Curing; Dielectric materials; Impedance; Insertion loss; Passband; Plasma chemistry; Plasma devices; Resonator filters; Coupled resonator filters; FBAR; SiLK; SiOCH; UHF resonator filters; bandpass filters; bulk acoustic wave devices; carbon-doped oxide; piezoelectric resonator filters; thin films;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441848