Title :
Artificial neural network coupled with robust principal components in near infrared spectroscopic analysis
Author :
Chia, Kim Seng ; Rahim, Herlina Abdul ; Rahim, Ruzairi Abdul
Author_Institution :
Dept. of Control & Instrum., Univ. Teknol. Malaysia, Skudai, Malaysia
Abstract :
The objectives of this paper are to demonstrate the use of a combination of artificial neural network and robust principal components (RPCs-ANN) to predict the soluble solid content of intact pineapple, non-invasively, based on near infrared spectral data, and to compare the performance of RPCs-ANN with artificial neural network based on classical principal components (PCs-ANN). First, we implemented second order derivative with first order Savitzky-Golay (SG) smoothing filter to pre-process the spectral data. Second, robust and classical principal component analysis approaches were utilized to reduce the dimension of spectral data and to produce robust principal components (RPCs) and principal components (PCs), respectively. Third, artificial neural network with RPCs as its inputs (RPCs-ANN) was trained based on Bayesian regularization to improve the generalization of the network by optimizing its regularization parameters. The effects of different number of inputs and hidden neurons are discussed. The findings suggest that RPCs-ANN is superior to PCs-ANN.
Keywords :
food processing industry; infrared spectroscopy; neural nets; principal component analysis; production engineering computing; Bayesian regularization; artificial neural network; first order Savitzky-Golay smoothing filter; intact pineapple; near infrared spectral data; near infrared spectroscopic analysis; robust principal components; second order derivative; soluble solid content; Artificial neural networks; Calibration; Neurons; Principal component analysis; Robustness; Solids; Spectroscopy; Artificial neural network; near infrared; pineapple; robust principal components; soluble solid content;
Conference_Titel :
Signal Processing and its Applications (CSPA), 2012 IEEE 8th International Colloquium on
Conference_Location :
Melaka
Print_ISBN :
978-1-4673-0960-8
DOI :
10.1109/CSPA.2012.6194682