A comparative study of high-frequency, low-profile planar transformer technologies

Author

Dai, N. ; Lofti, A.W. ; Skutt, G. ; Tabisz, W. ; Lee, F.C.

Author_Institution

Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

1994

fDate

13-17 Feb 1994

Firstpage

226

Abstract

A study several of available technologies used to construct low-profile, planar transformers is presented. Finite element analysis is used to determine an appropriate winding configuration with low AC resistance and leakage inductance. The advantages and disadvantages of printed circuit board (PCB), flex-circuit and stamped-copper winding technologies are evaluated. The trade-offs between electrical and mechanical properties are emphasized. It is demonstrated that the secondary winding termination resistances for these transformers constitute a large percentage of the total AC resistance of the transformer

Keywords

finite element analysis; high-frequency transformers; power electronics; power transformers; transformer windings; AC resistance; HF planar transformer; PCB; electrical properties; finite element analysis; flex-circuit; leakage inductance; low profile; mechanical properties; power electronic circuits; printed circuit board; secondary winding termination resistances; stamped-copper winding; winding configuration; Guidelines; Inductance; Magnetic analysis; Magnetic cores; Magnetic fields; Mechanical factors; Power electronics; Power engineering and energy; Power supplies; Transformer cores;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 1994. APEC '94. Conference Proceedings 1994., Ninth Annual

Conference_Location

Orlando, FL

Print_ISBN

0-7803-1456-5

Type

conf

DOI

10.1109/APEC.1994.316395

Filename

316395