Title :
MiMAC - A New Multilayer Thin Film Microwave Component Technology
Author_Institution :
Marconi Electronic Devices Limited, Doddington Road, Lincoln LN6.3LF
Abstract :
A new integrated thin film process is described which permits the inclusion of passive circuit elements at the substrate fabrication stage. Microwave Monolithic Alumina Circuits (MiMAC) offer cost and performance advantages over conventional chip and wire hybrids. Details of this process are presented, together with results for a MiMAC amplifier design which shows improved performance over it´s conventional hybrid equivalent.
Keywords :
Costs; Fabrication; Integrated circuit technology; Microwave circuits; Microwave technology; Nonhomogeneous media; Passive circuits; Substrates; Thin film circuits; Transistors;
Conference_Titel :
Microwave Conference, 1988. 18th European
Conference_Location :
Stockholm, Sweden
DOI :
10.1109/EUMA.1988.333946
