Strategies for Microwave and Millimeter Wave Packaging Today

Microwave and millimeter wave package requirements differ considerably from those for low frequency applications. Microwave packages are characterized by a low lead count (usually less than 20), with high lead-lead isolation, and controlled transmission line impedance levels. Packages normally are embedded in a 50 Ohm impedance environment. At microwave frequencies, performance is significantly more dependent on the choice of a suitable package than at lower frequencies. Any strategy for the selection of a package must begin with the recognition of the functions provided by the package. In this paper we will describe the issues involved in choosing a package for a specific application today. We will pursue the results of surveys to compare the properties of various package devices. Finally, we will conclude with a strategy for choosing a suitable package.