Fabrication and piezoelectricity of fluoropolymer films with patterned structure

Author

Zhang, Xiaoqing ; Cao, Gongxun ; Sun, Zhuanlan ; Xia, Zhongfu ; Zeng, Changchun ; Zhang, Chuck ; Wang, Ben

Author_Institution

Dept. of Phys., Tongji Univ., Shanghai, China

fYear

2010

fDate

4-9 July 2010

Firstpage

1

Lastpage

4

Abstract

Laminated fluoroethylenepropylene (FEP) and porous polytetrafluoroethylene (PTFE) films with patterned void structure were successfully fabricated. An improved model taking into account of both the mechanical structure and charge distribution was used to describe the behavior of the fabricated films. The Young´s modulus of the three-layer FEP/PTFE film is ~0.5 MPa. Maximum quasi-static piezoelectric d₃₃ coefficient up to 500 pC/N is achieved. Compared to the PP piezoelectrets, which loose their piezoelectric activity completely at the annealing temperature of 150°C within 60 min, the laminated FEP/PTFE films show significantly improved thermal stability. For example, the d₃₃-coefficient retains ~22% of the initial value for samples annealed at 150°C for 4500 min.

Keywords

Young´s modulus; annealing; piezoelectric materials; polymer films; porous materials; thin films; Young´s modulus; annealing; charge distribution; fluoropolymer films; laminated fluoroethylenepropylene films; mechanical structure; patterned void structure; piezoelectrets; piezoelectric coefficient; piezoelectricity; porous polytetrafluoroethylene Alms; temperature 150 degC; thermal stability; time 60 min; Annealing; Dielectrics; Electrets; Films; Force; Thermal stability; patterned structure; piezoelectret; piezoelectricity; template;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on

Conference_Location

Potsdam

Print_ISBN

978-1-4244-7945-0

Electronic_ISBN

978-1-4244-7943-6

Type

conf

DOI

10.1109/ICSD.2010.5568037

Filename

5568037