• DocumentCode
    2003138
  • Title

    Heavy ion sensitivity of a SRAM in SOI bulk-like technology

  • Author

    Ferlet-Cavrois, V. ; Musseau, O. ; Leray, J.L. ; Coïc, Y.M. ; Pelloie, J.L.

  • Author_Institution
    CEA Centre de Bruyeres-le-Chatel, France
  • fYear
    1993
  • fDate
    13-16 Sep 1993
  • Firstpage
    571
  • Lastpage
    576
  • Abstract
    The sensitivity to heavy ions of a thick SOI technology compatible with bulk design rules is studied in this paper. A model is built, relying on two basic phenomena gathered in this thick SOI technology: the collection of the charge injected by the incident ion and its amplification by the parasitic bipolar. Theoretical results are then compared with experimental ones. The oblique incidence induces a sharp increase of the sensitivity of the device
  • Keywords
    CMOS integrated circuits; SRAM chips; integrated circuit testing; ion beam effects; semiconductor-insulator boundaries; silicon; SOI bulk-like technology; SRAM; bulk design rules; charge collection; heavy ion sensitivity; incident ion; oblique incidence; parasitic bipolar; CMOS process; CMOS technology; Circuits; Inverters; Isolation technology; Numerical simulation; Random access memory; Semiconductor device modeling; Silicon; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation and its Effects on Components and Systems, 1993.,RADECS 93., Second European Conference on
  • Conference_Location
    St. Malo
  • Print_ISBN
    0-7803-1793-9
  • Type

    conf

  • DOI
    10.1109/RADECS.1993.316518
  • Filename
    316518