DocumentCode
2003459
Title
DC conduction mechanisms in epoxy nanocomposites under the humid environment
Author
Zou, Chen ; Fothergill, John C. ; Zhang, Shihai ; Zhou, Xin
Author_Institution
Mater. Res. Inst., Pennsylvania State Univ., University Park, PA, USA
fYear
2010
fDate
4-9 July 2010
Firstpage
1
Lastpage
4
Abstract
In this paper, time dependent direct current conduction characteristics were studied for both micro- and nano-filled epoxy composites at 0% and 75% relative humidity with temperature range of 298K to 343K. At low loading content of nanofillers, composites had similar conduction mechanisms as the matrix, which were ohmic conduction at low field or trap-filled limit conduction dominated at higher field. However, the higher concentrations of inorganic filler would shift the conduction mechanism to Schottky emission at higher field. Once the buildup of space charge was completed in composites, the quasi-steady state current deviated from the low-field linear relation with electric field (ohmic conduction). Moisture and the higher concentrations of nano-filler enhanced charge decay in composite and increased the threshold field of space charge accumulation, which was confirmed by previous pulsed electroacoustic (PEA) measurements.
Keywords
electrical conductivity; filled polymers; humidity; moisture; nanocomposites; pulsed electroacoustic methods; resins; space charge; DC conduction mechanism; Schottky emission; epoxy nanocomposites; humid environment; inorganic filler; microfilled epoxy composites; moisture; nanofilled epoxy composites; nanofillers; ohmic conduction; pulsed electroacoustic measurement; quasisteady state current; relative humidity; space charge; temperature 298 K to 343 K; time dependent direct current conduction; trap-filled limit conduction; Current density; Dielectrics; Electric fields; Nanocomposites; Silicon compounds; Space charge; DC condcution; epoxy; nanocomposite; space charge;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
Conference_Location
Potsdam
Print_ISBN
978-1-4244-7945-0
Electronic_ISBN
978-1-4244-7943-6
Type
conf
DOI
10.1109/ICSD.2010.5568060
Filename
5568060
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