• DocumentCode
    2003602
  • Title

    Buds for treeing in epoxy nanocomposites and their possible interaction with nano fillers

  • Author

    Tanaka, Toshikatsu

  • Author_Institution
    IPS Res. Center, Waseda Univ., Kitakyushu, Japan
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Breakdown lifetime for treeing is enormously extended for polymers when they are doped with nano fillers. It includes a budding process and a growing process. The latter process is mainly determined by erosion due to partial discharge attack, and thus suppressed by existing nano fillers. The former process is not so clear, but it must be a dielectric breakdown that takes place due to electron injection and transport at high electric field. How would nano fillers react to the budding? SEM observation indicates for epoxy/silica nanocomposites that treeing buds of several tens nm in diameter are closely linked with nano fillers. Such tree buds are analyzed from the basic process of electron injection and transport in polymers at high electric field with the aid of a Schubweg concept and a multi-core model. As a result, it is concluded that buds for treeing is possibly affected by trapping by localized states and local electric field induced by nano fillers.
  • Keywords
    epoxy insulation; nanocomposites; partial discharges; scanning electron microscopy; silicon compounds; trees (electrical); SEM observation; breakdown lifetime; budding process; epoxy nanocomposites; epoxy-silica nanocomposites; growing process; nano filler; partial discharge attack; treeing buds; Electric fields; Electrodes; Electron traps; Metals; Partial discharges; Plastics; buds for treeing; dielectric breakdown; initial trees; nanocomposites; treeing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5568068
  • Filename
    5568068