DocumentCode
2003602
Title
Buds for treeing in epoxy nanocomposites and their possible interaction with nano fillers
Author
Tanaka, Toshikatsu
Author_Institution
IPS Res. Center, Waseda Univ., Kitakyushu, Japan
fYear
2010
fDate
4-9 July 2010
Firstpage
1
Lastpage
4
Abstract
Breakdown lifetime for treeing is enormously extended for polymers when they are doped with nano fillers. It includes a budding process and a growing process. The latter process is mainly determined by erosion due to partial discharge attack, and thus suppressed by existing nano fillers. The former process is not so clear, but it must be a dielectric breakdown that takes place due to electron injection and transport at high electric field. How would nano fillers react to the budding? SEM observation indicates for epoxy/silica nanocomposites that treeing buds of several tens nm in diameter are closely linked with nano fillers. Such tree buds are analyzed from the basic process of electron injection and transport in polymers at high electric field with the aid of a Schubweg concept and a multi-core model. As a result, it is concluded that buds for treeing is possibly affected by trapping by localized states and local electric field induced by nano fillers.
Keywords
epoxy insulation; nanocomposites; partial discharges; scanning electron microscopy; silicon compounds; trees (electrical); SEM observation; breakdown lifetime; budding process; epoxy nanocomposites; epoxy-silica nanocomposites; growing process; nano filler; partial discharge attack; treeing buds; Electric fields; Electrodes; Electron traps; Metals; Partial discharges; Plastics; buds for treeing; dielectric breakdown; initial trees; nanocomposites; treeing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
Conference_Location
Potsdam
Print_ISBN
978-1-4244-7945-0
Electronic_ISBN
978-1-4244-7943-6
Type
conf
DOI
10.1109/ICSD.2010.5568068
Filename
5568068
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