DocumentCode :
2004117
Title :
Isolation and identification of a polyacrylamide-degrading fungus and its degradation characteristics
Author :
Li, Shu-qin ; Wang, Lei ; JIN, Hong-xin ; Xu, Jing-gang
Author_Institution :
Sch. of Resources & Environ., Northeast Agric. Univ., Harbin, China
fYear :
2011
fDate :
16-18 Sept. 2011
Firstpage :
5320
Lastpage :
5323
Abstract :
A polyacrylamide-degrading fungus was selected from the soil in the chemical plant producting polyacrylamide, and it was named PAMF4. It is capable of utilizing polyacrylamide as sole nitrogen source. According to the morphological characteristics and 18S rRNA sequence analysis, the strain was preliminarily identified as Geotrichum candidum. As the indices with PAMF4 growth and polyacrylamide degradation rate, it was studied that effects of the main environmental factors (initial pH, temperature, polyacrylamide concentration and inoculation amount) on PAMF4 growth and degradation capacity. The results indicated that the most appropriate conditions of PAMF4 growth and polyacryl-amide degradation were as fallows: pH was 7.0, temperature was 30°C, polyacrylamide concentration was 500 mg-Lιand inoculation quantity ( v/v ) was 3 %, while degradation rate of polyacrylamide in basic culture medium was 32.61 % in 8d.
Keywords :
biotechnology; environmental factors; industrial plants; microorganisms; soil; soil pollution; 18S rRNA sequence analysis; Geotrichum candidum; PAMF4 degradation; PAMF4 growth; chemical plants; environmental factors; inoculation; nitrogen source; polyacrylamide degradation; polyacrylamide-degrading fungus; soil; temperature 30 degC; Degradation; Educational institutions; Microorganisms; Soil; Strain; Water conservation; Fungus; Geotrichum candidum; Polyacrylamide; biodegradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Control Engineering (ICECE), 2011 International Conference on
Conference_Location :
Yichang
Print_ISBN :
978-1-4244-8162-0
Type :
conf
DOI :
10.1109/ICECENG.2011.6058449
Filename :
6058449
Link To Document :
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