Title :
VLSI design of 3D display processing chip for head-mounted display
Author :
Ge, Chenyang ; Zheng, Nanning ; Mei, Kuizhi ; Zhao, Jizhong
Author_Institution :
Inst. of Artificial Intell. & Robot., Xi´´an Jiao tong Univ., Xi´´an, China
Abstract :
In order to develop the core chip supporting binocular stereo displays for head-mounted display (HMD) and glasses-TV, a VLSI design scheme is proposed by using pipeline architecture for 3D display processing chip (HMD100B). Some key techniques including stereo display processing and high precision video scaling based on bicubic interpolation, and their hardware implementations are presented. A new method of field rate up-conversion for analog stereo video signal (CVBS) is proposed, and it can eliminate the large area of flicker. The proposed HMD100B chip is verified by FPGA, and the stereo display image is clear. As one of innovative and high integration SoC chip, HMD100B is designed by digital and analog mixed circuit. It can support binocular stereo display, has better scaling effect and integration. Hence it is applicable in virtual reality (VR), 3D games and other microdisplay domains.
Keywords :
VLSI; field programmable gate arrays; integrated circuit design; mixed analogue-digital integrated circuits; stereo image processing; system-on-chip; three-dimensional displays; 3D display processing chip; FPGA; HMD100B; SoC chip; VLSI design; analog stereo video signal; bicubic interpolation; binocular stereo displays; field rate up-conversion; glasses-TV; head-mounted display; high precision video scaling; mixed digital analog circuit; pipeline architecture; stereo display image; stereo display processing; Flat panel displays; Large screen displays; Liquid crystal displays; Microdisplays; Pipelines; SDRAM; Signal processing; Three dimensional displays; Very large scale integration; Virtual reality; 3D display; SoC; field rate up-conversion; head-mounted display; video scaling;
Conference_Titel :
Games Innovations Conference, 2009. ICE-GIC 2009. International IEEE Consumer Electronics Society's
Conference_Location :
London
Print_ISBN :
978-1-4244-4459-5
Electronic_ISBN :
978-1-4244-4460-1
DOI :
10.1109/ICEGIC.2009.5293596