Optical backplane demonstrators using micro-optics and smart pixel transceiver arrays

Author

Plant, David V. ; Hinton, H. Scott

Author_Institution

Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada

fYear

1995

fDate

28-31 Mar 1995

Firstpage

179

Lastpage

183

Abstract

We have demonstrated a representative portion of an optical backplane using FET-SEED smart pixels and free-space optics to interconnect printed circuit boards (PCBs) in a two board, unidirectional link configuration. 4×4 arrays of FET-SEED transceivers were designed, fabricated, and packaged at the PCB level. The optical interconnection was constructed using diffractive microoptics, and custom optomechanics. The system was operated in two modes, one showing high data throughput, 50 MBit/sec, and the other demonstrating large connection densities, 2222 channel/cm2

Keywords

SEEDs; smart pixels; transceivers; 50 Mbit/s; FET-SEED smart pixels; connection densities; custom optomechanics; diffractive microoptics; free-space optics; micro-optics; optical backplane demonstrators; optical interconnection; smart pixel transceiver arrays; unidirectional link configuration; Backplanes; Integrated circuit interconnections; Optical arrays; Optical design; Optical diffraction; Optical interconnections; Packaging; Printed circuits; Smart pixels; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Computers and Communications, 1995., Conference Proceedings of the 1995 IEEE Fourteenth Annual International Phoenix Conference on

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-2492-7

Type

conf

DOI

10.1109/PCCC.1995.472494

Filename

472494