DocumentCode :
2005547
Title :
Time Domain Analysis of Multilevel Interconnections Effects in High Performance IC Packages
Author :
Razban, T. ; El kamoun, N. ; Chilo, J.
Author_Institution :
LEMO-ENSERG 23 rue des martyrs B.P. 257 -38016 GRENOBLE Cédex FRANCE
fYear :
1989
fDate :
4-7 Sept. 1989
Firstpage :
839
Lastpage :
844
Abstract :
Analysis of discontinuities effects due to passive components (interconnecting lines) in modern packages is given. Interconnections used are multilevel designed and burried in multilayered dielectric substrate. Theoretical predictions based on proposed analysis are compared with the experimental results obtained on specific test vehicles.
Keywords :
Bonding; Integrated circuit interconnections; Integrated circuit packaging; Performance analysis; Pins; Space technology; Strips; Time domain analysis; Transmission line discontinuities; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 1989. 19th European
Conference_Location :
London, UK
Type :
conf
DOI :
10.1109/EUMA.1989.334072
Filename :
4132784
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2005547
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