Title :
Three-dimensional transient simulation of niagnetoresistive head temperature during an ESD event
Author_Institution :
Seagate Technology Inc. 7801 Computer Avenue, Minneapolis, Mn 55435
Abstract :
Melting of the sensing element in MR (magnetoresistive) heads for disc drives due to ESD events is a commonly seen mode of damage. The temperature in an MR head during an ESD event is modeled in 3 dimensions using finite-elements. Results will be given for a range of thermal and electrical properties, dimensions, and discharge time constants.
Keywords :
Contacts; Discrete event simulation; Electrostatic discharge; Insulation; Magnetic heads; Magnetic sensors; Resistance heating; Surface resistance; Temperature sensors;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium,1997. Proceedings
Conference_Location :
Orlando, FL, USA
Print_ISBN :
1-878303-69-4
DOI :
10.1109/EOSESD.1997.634269
