DocumentCode
2005592
Title
Three-dimensional transient simulation of niagnetoresistive head temperature during an ESD event
Author
Chang, Clifton
Author_Institution
Seagate Technology Inc. 7801 Computer Avenue, Minneapolis, Mn 55435
fYear
1997
fDate
25-25 Sept. 1997
Firstpage
405
Lastpage
411
Abstract
Melting of the sensing element in MR (magnetoresistive) heads for disc drives due to ESD events is a commonly seen mode of damage. The temperature in an MR head during an ESD event is modeled in 3 dimensions using finite-elements. Results will be given for a range of thermal and electrical properties, dimensions, and discharge time constants.
Keywords
Contacts; Discrete event simulation; Electrostatic discharge; Insulation; Magnetic heads; Magnetic sensors; Resistance heating; Surface resistance; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium,1997. Proceedings
Conference_Location
Orlando, FL, USA
Print_ISBN
1-878303-69-4
Type
conf
DOI
10.1109/EOSESD.1997.634269
Filename
634269
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