DocumentCode :
2005797
Title :
Contact Resistance Evolution of Au-Au Micro-Contacts with Encapsulated Ag Colloids
Author :
Toler, Benjamin ; Stilson, Christopher ; Coutu, Ronald
fYear :
2013
fDate :
22-25 Sept. 2013
Firstpage :
1
Lastpage :
8
Abstract :
This paper reports the contact resistance evolution results of thin film, sputtered gold with encapsulated Ag colloids, micro-contacts dynamically tested up to 3kHz. The upper contact support structure consists of a sputtered gold surface micromachined, fixed-fixed beam designed with sufficient restoring force to overcome adhesion. The hemisphere-upper and planar-lower contacts are mated with a calibrated, external load resulting in approximately 100μN´s of contact force. Contact resistance is measured, in-situ, using a cross-bar configuration and the entire apparatus is isolated from external vibration and housed in an enclosure to minimize contamination due to ambient environment. Additionally, contact cycling and data collection are automated using a computer and LabVIEW. The results showed that Au-Au micro-contact had a final resistance of 14Ωs after 10 million cycles and 81Ωs after 8 million cycles with Au-Ag micro-contacts.
Keywords :
adhesion; colloids; contact resistance; gold; micromachining; silver; sputter deposition; thin films; virtual instrumentation; Ag; Au; Au-Au; Au-Au microcontacts; LabVIEW; adhesion; contact cycling; contact force; contact resistance; cross-bar configuration; data collection; encapsulated Ag colloids; external load; external vibration; fixed-fixed beam; hemisphere-upper contacts; planar-lower contacts; resistance 14 ohm; resistance 81 ohm; sputtered gold surface micromachine; thin film; Contact resistance; Fixtures; Force; Gold; Resistance; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th
Conference_Location :
Newport, RI
ISSN :
1062-6808
Print_ISBN :
978-1-4799-1556-9
Type :
conf
DOI :
10.1109/HOLM.2013.6651404
Filename :
6651404
Link To Document :
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