• DocumentCode
    2005797
  • Title

    Contact Resistance Evolution of Au-Au Micro-Contacts with Encapsulated Ag Colloids

  • Author

    Toler, Benjamin ; Stilson, Christopher ; Coutu, Ronald

  • fYear
    2013
  • fDate
    22-25 Sept. 2013
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    This paper reports the contact resistance evolution results of thin film, sputtered gold with encapsulated Ag colloids, micro-contacts dynamically tested up to 3kHz. The upper contact support structure consists of a sputtered gold surface micromachined, fixed-fixed beam designed with sufficient restoring force to overcome adhesion. The hemisphere-upper and planar-lower contacts are mated with a calibrated, external load resulting in approximately 100μN´s of contact force. Contact resistance is measured, in-situ, using a cross-bar configuration and the entire apparatus is isolated from external vibration and housed in an enclosure to minimize contamination due to ambient environment. Additionally, contact cycling and data collection are automated using a computer and LabVIEW. The results showed that Au-Au micro-contact had a final resistance of 14Ωs after 10 million cycles and 81Ωs after 8 million cycles with Au-Ag micro-contacts.
  • Keywords
    adhesion; colloids; contact resistance; gold; micromachining; silver; sputter deposition; thin films; virtual instrumentation; Ag; Au; Au-Au; Au-Au microcontacts; LabVIEW; adhesion; contact cycling; contact force; contact resistance; cross-bar configuration; data collection; encapsulated Ag colloids; external load; external vibration; fixed-fixed beam; hemisphere-upper contacts; planar-lower contacts; resistance 14 ohm; resistance 81 ohm; sputtered gold surface micromachine; thin film; Contact resistance; Fixtures; Force; Gold; Resistance; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th
  • Conference_Location
    Newport, RI
  • ISSN
    1062-6808
  • Print_ISBN
    978-1-4799-1556-9
  • Type

    conf

  • DOI
    10.1109/HOLM.2013.6651404
  • Filename
    6651404